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Usage
Mainly used for bookbinding (bound book, high-end books, book cover and book spine), with good adhesion to various paper substrates and difficult-to-stick papers.
Properties
high bonding strength, good fluidity, no wire drawing, good thermal stability and operational performance, good heat and humidity resistance and chemical resistance.
Technical Properties
Appearance |
White solid, small granule |
Viscosity |
2500~5000mPa·s @130℃ |
|
Open time (depend on temperature and substrate) |
50~100s |
Package |
Aluminum foil bag 500～2000g, 20kg/barrel, 200 kg/barrel
|
Recommended melt/ sizing temperature |
120 ~ 140 ℃ |
Room temperature |
More than 15 ℃ |
Precautions
1. The surface of the substrate shall be free of oil, dust and other pollutants to ensure that the surface is clean and dry.
2. After the production equipment is used up, it shall be cleaned with special cleaning agent.
3. It shall not be mixed with other brands of hotmelt glue.
4. In order to achieve complete curing, the products that have completed the process operation are best placed in a working environment with appropriate temperature and humidity
(recommended temperature: 23 ~ 25 ℃, relative humidity about 65%)
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